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Sigma-Aldrich

Aldrich® Negative Photoresist Kit I

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About This Item

UNSPSC Code:
12352300
NACRES:
NA.23

storage temp.

2-8°C

Related Categories

General description

Aldrich® Negative Photoresist Kit I consists of materials for photolithography. The photoresist can be spin coated on the glass substrate for the formation of electrode arrays. The kit also provides masking and patterning on the glass surface.

Application

Aldrich® Negative Photoresist Kit I has been used in the fabrication of microelectrodes by photolithography. It can also be used to fabricate the droplet-based microfluidic device, microfluidic chips, glass optical waveguides, and integrated grating couplers.

Legal Information

Aldrich is a registered trademark of Sigma-Aldrich Co. LLC

Kit Components Also Available Separately

Product No.
Description
SDS
  • 651761Negative resist remover I 250 mLSDS
  • 651788Negative resist developer I 250 mLSDS
  • 651796Negative photoresist I 100 mLSDS
  • 651974Negative resist thinner I 100 mLSDS

signalword

Danger

Hazard Classifications

Acute Tox. 4 Dermal - Acute Tox. 4 Inhalation - Acute Tox. 4 Oral - Aquatic Chronic 2 - Asp. Tox. 1 - Carc. 2 - Eye Dam. 1 - Repr. 1B - Skin Corr. 1 - STOT RE 2 Inhalation - STOT SE 3

target_organs

Central nervous system,Liver,Kidney, Respiratory system

Storage Class

6.1C - Combustible acute toxic Cat.3 / toxic compounds or compounds which causing chronic effects

flash_point_f

Not applicable

flash_point_c

Not applicable

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Fabrication and characterization of optical waveguides and grating couplers
Sharpe JP, et al.
European Journal of Physics, 34(5), 1317-1317 (2013)
A compact 3D-printed interface for coupling open digital microchips with Venturi easy ambient sonic-spray ionization mass spectrometry
Hu J, et al.
Analyst, 140(5), 1495-1501 (2015)
Fabrication and characterization of optical waveguides and grating couplers
J P Sharpe, et al.
European Journal of Physics, 34, 1317-1317 (2013)
High-speed droplet actuation on single-plate electrode arrays
Banerjee AN, et al.
Journal of Colloid and Interface Science, 362(2), 567-574 (2011)

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