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643262

Sigma-Aldrich

Gold coated silicon wafer

99.999% (Au), layer thickness 1000 Å, 99.99% (Ti)

Synonym(s):
gold coated silicon, gold coated wafer
Linear Formula:
Au
Molecular Weight:
196.97
MDL number:
PubChem Substance ID:
NACRES:
NA.23

Quality Level

Assay

99.99% (Ti)
99.999% (Au)

diam. × thickness

4 in. × 500 μm

layer thickness

1000 Å

matrix attachment

Titanium, as adhesion layer used to bind the gold to the silicon wafer.

SMILES string

[Au]

InChI

1S/Au

InChI key

PCHJSUWPFVWCPO-UHFFFAOYSA-N

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Supelco

16259

Silicon Standard for AAS

Quality Level

100

Quality Level

-

Quality Level

300

Quality Level

100

assay

99.99% (Ti)

assay

-

assay

-

assay

-

diam. × thickness

4 in. × 500 μm

diam. × thickness

-

diam. × thickness

-

diam. × thickness

-

layer thickness

4 in. × 500 μm

layer thickness

-

layer thickness

-

layer thickness

-

matrix attachment

Titanium, as adhesion layer used to bind the gold to the silicon wafer.

matrix attachment

-

matrix attachment

-

matrix attachment

-

General description

Our gold-coated silicon wafers use electron-beam lithography to form amorphous layers (50Å of titanium followed by 1000Å of gold) on top of the silicon wafer.
The product is highly crystalline, with <111> orientation gold and <100> orientation silicon wafer is used. Titanium is used as an adhesion layer to bind gold to the silicon wafer.

Application

Gold coated silicon wafers may be used in soft lithography for micro and nanoscale patterning.

Packaging

Packaging 1 set in single wafer shipper

Storage Class Code

11 - Combustible Solids

WGK

WGK 3

Flash Point(F)

Not applicable

Flash Point(C)

Not applicable

Certificate of Analysis

Enter Lot Number to search for Certificate of Analysis (COA).

Certificate of Origin

Enter Lot Number to search for Certificate of Origin (COO).

More Documents

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