- 643262
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643262
Gold coated silicon wafer
99.999% (Au), layer thickness 1000 Å, 99.99% (Ti)
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Synonym(s):
gold coated silicon, gold coated wafer
Linear Formula:
Au
Recommended Products
Quality Level
Assay
99.99% (Ti)
99.999% (Au)
diam. × thickness
4 in. × 500 μm
layer thickness
1000 Å
matrix attachment
Titanium, as adhesion layer used to bind the gold to the silicon wafer.
SMILES string
[Au]
InChI
1S/Au
InChI key
PCHJSUWPFVWCPO-UHFFFAOYSA-N
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This Item | ERMEG001 | 16259 | 912409 |
|---|---|---|---|
| Quality Level 100 | Quality Level - | Quality Level 300 | Quality Level 100 |
| assay 99.99% (Ti) | assay - | assay - | assay - |
| diam. × thickness 4 in. × 500 μm | diam. × thickness - | diam. × thickness - | diam. × thickness - |
| layer thickness 4 in. × 500 μm | layer thickness - | layer thickness - | layer thickness - |
| matrix attachment Titanium, as adhesion layer used to bind the gold to the silicon wafer. | matrix attachment - | matrix attachment - | matrix attachment - |
General description
Our gold-coated silicon wafers use electron-beam lithography to form amorphous layers (50Å of titanium followed by 1000Å of gold) on top of the silicon wafer.
The product is highly crystalline, with <111> orientation gold and <100> orientation silicon wafer is used. Titanium is used as an adhesion layer to bind gold to the silicon wafer.
Application
Gold coated silicon wafers may be used in soft lithography for micro and nanoscale patterning.
Packaging
Packaging 1 set in single wafer shipper
Storage Class Code
11 - Combustible Solids
WGK
WGK 3
Flash Point(F)
Not applicable
Flash Point(C)
Not applicable
Certificate of Analysis
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Certificate of Origin
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