643262
99.99% (Ti)
99.999% (Au)
4 in. × 500 μm
1000 Å
Titanium, as adhesion layer used to bind the gold to the silicon wafer.
[Au]
1S/Au
PCHJSUWPFVWCPO-UHFFFAOYSA-N
1 of 4
This Item | ERMEG001 | 16259 | 912409 |
---|---|---|---|
Quality Level 100 | Quality Level - | Quality Level 300 | Quality Level 100 |
assay 99.99% (Ti) | assay - | assay - | assay - |
diam. × thickness 4 in. × 500 μm | diam. × thickness - | diam. × thickness - | diam. × thickness - |
layer thickness 4 in. × 500 μm | layer thickness - | layer thickness - | layer thickness - |
matrix attachment Titanium, as adhesion layer used to bind the gold to the silicon wafer. | matrix attachment - | matrix attachment - | matrix attachment - |
11 - Combustible Solids
WGK 3
Not applicable
Not applicable
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