1.02700

Copper

foil about 0.1 mm thickness for analysis EMSURE^®

• 別名: Copper
• 実験式（ヒル表記法）: Cu
• CAS番号: 7440-50-8
• 分子量: 63.55
• MDL番号: MFCD00010965
• UNSPSCコード: 12141711
• EC Index Number: 231-159-6
• NACRES: NA.21

特性

• 品質水準: 300
• 製品種目: EMSURE^®
• アッセイ: ≥99.7% (iodometric)
• フォーム: solid
• 不純物: ≤0.02% Substances insoluble in nitric acid
• bp: 2580 °C/1013 hPa
• mp: 1083 °C
• 密度: 8.96 g/cm³
• かさ密度: 1000 kg/m³
• 微量陽イオン: Ag: ≤0.002%; As: ≤0.0002%; Fe: ≤0.005%; Mn: ≤0.005%; Pb: ≤0.05%; Sb: ≤0.005%; Sn: ≤0.005%
• 保管温度: 2-30°C
• SMILES記法: [Cu]
• InChI: 1S/Cu
• InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N

詳細

アプリケーション

• Electron-electron scattering limits thermal conductivity of metals under extremely high electron temperatures: The study discusses how copper′s thermal properties are influenced under extreme conditions, applicable in high-performance electronics (Karna and Giri, 2024).


• Lateral Flow Assay Biotesting by Utilizing Plasmonic Nanoparticles Made of Inexpensive Metals: Demonstrates copper′s potential as a cost-effective alternative to gold in diagnostic assays, broadening access to healthcare technologies (Bahamondes Lorca et al., 2024).

アナリシスノート

Assay (iodometric): ≥ 99.7 %
Substances insoluble in nitric acid: ≤ 0.02 %
Ag (Silver): ≤ 0.002 %
As (Arsenic): ≤ 0.0002 %
Fe (Iron): ≤ 0.005 %
Mn (Manganese): ≤ 0.005 %
Pb (Lead): ≤ 0.05 %
Sb (Antimony): ≤ 0.005 %
Sn (Tin): ≤ 0.005 %

法的情報

EMSURE is a registered trademark of Merck KGaA, Darmstadt, Germany

安全性情報

• 保管分類コード: 13 - Non Combustible Solids
• WGK: WGK 2
• 引火点(°F): Not applicable
• 引火点(℃): Not applicable