Skip to Content
MilliporeSigma
All Photos(1)

Documents

667528

Sigma-Aldrich

Copper etchant

Synonym(s):

Copper etching solution

Sign Into View Organizational & Contract Pricing


About This Item

MDL number:
UNSPSC Code:
12352300
NACRES:
NA.23

vapor density

1.3 (vs air)

Quality Level

Application

CE-200 solution can be used to etch out the copper residue or foil from the chemical vapor deposited (CVD) graphene or carbonated films by immersing the substrate with the nanomaterial into the etchant solution for 30 min.
It is ideal for spray etching of copper. Ferric chloride based Cu etchant with etch rate of 0.5 mil/min @ 40 °C.

pictograms

Corrosion

signalword

Danger

Hazard Classifications

Eye Dam. 1 - Met. Corr. 1 - Skin Irrit. 2

Storage Class

8B - Non-combustible, corrosive hazardous materials

wgk_germany

WGK 1

flash_point_f

Not applicable

flash_point_c

Not applicable

ppe

Faceshields, Gloves, Goggles, type ABEK (EN14387) respirator filter


Certificates of Analysis (COA)

Search for Certificates of Analysis (COA) by entering the products Lot/Batch Number. Lot and Batch Numbers can be found on a product’s label following the words ‘Lot’ or ‘Batch’.

Already Own This Product?

Find documentation for the products that you have recently purchased in the Document Library.

Visit the Document Library

Microbial colonisation of transparent glass-like carbon films triggered by a reversible radiation-induced hydrophobic to hydrophilic transition
Jalvo B, et al.
Royal Society of Chemistry Advances, 6(55), 50278-50287 (2016)
The effect of copper pre-cleaning on graphene synthesis
Kim SM, et al.
Nanotechnology, 24(36), 365602-365602 (2013)
Copper etching with cupric chloride and regeneration of waste etchant
Cakir O
Journal of Materials Processing Technology, 175(1-3), 63-68 (2006)

Our team of scientists has experience in all areas of research including Life Science, Material Science, Chemical Synthesis, Chromatography, Analytical and many others.

Contact Technical Service