901621

Buffered oxide etchant (BOE) 10:1

• 동의어(들): BHF, Buffered HF
• UNSPSC 코드: 12161700
• NACRES: NA.23

속성

• 양식: liquid

설명

일반 설명

Buffered oxide etchant (BOE) is a wet etchant used in microfabrication. Its primary use is in etching thin films of silicon dioxide (SiO₂) or silicon nitride (Si₃N₄). It is a mixture of a buffering agent, such as ammonium fluoride (NH₄F), and hydrofluoric acid (HF). Concentrated HF etches silicon dioxide too quickly for good process control and also peels photoresist used in lithographic patterning.

애플리케이션

Buffered oxide etchant (BOE) 10:1 can be used in the etching of titanium carbide, which can be used in microelectromechanical systems (MEMS). It can also be used in the etching of spin-on-dopant (SOD) for the development of conductor-insulator-conductor tunneling diodes. It can also be used to enhance the surface of fused quartz devices.

안전성 정보

• 픽토그램: GHS06,GHS05
• 신호어: Danger
• 유해 및 위험 성명서: H301 + H331,H310,H314
• 예방조치 성명서: P261 - P271 - P280 - P303 + P361 + P353 - P304 + P340 + P310 - P305 + P351 + P338
• Hazard Classifications: Acute Tox. 2 Dermal - Acute Tox. 3 Inhalation - Acute Tox. 3 Oral - Eye Dam. 1 - Skin Corr. 1B
• Storage Class Code: 6.1B - Non-combustible acute toxic Cat. 1 and 2 / very toxic hazardous materials
• WGK: WGK 2
• Flash Point (°F): Not applicable
• Flash Point (°C): Not applicable