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643262

Sigma-Aldrich

Gold coated silicon wafer

99.999% (Au), layer thickness 1000 Å, 99.99% (Ti)

Sinonimo/i:

gold coated silicon, gold coated wafer

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About This Item

Formula condensata:
Au
Peso molecolare:
196.97
Numero MDL:
MFCD00003436
Codice UNSPSC:
12352103
ID PubChem:
329759955
NACRES:
NA.23

Saggio

99.99% (Ti)
99.999% (Au)

diam. × spessore

4 in. × 500 μm

Spessore strato

1000 Å

Gruppi immobilizzati alla matrice

Titanium, as adhesion layer used to bind the gold to the silicon wafer.

Stringa SMILE

[Au]

InChI

1S/Au
PCHJSUWPFVWCPO-UHFFFAOYSA-N

Categorie correlate

Descrizione generale

Our gold-coated silicon wafers use electron-beam lithography to form amorphous layers (50Å of titanium followed by 1000Å of gold) on top of the silicon wafer.
The product is highly crystalline, with <111> orientation gold and <100> orientation silicon wafer is used. Titanium is used as an adhesion layer to bind gold to the silicon wafer.

Applicazioni

Gold coated silicon wafers may be used in soft lithography for micro and nanoscale patterning.

Confezionamento

Packaging 1 set in single wafer shipper

Codice della classe di stoccaggio

11 - Combustible Solids

Classe di pericolosità dell'acqua (WGK)

WGK 3

Punto d’infiammabilità (°F)

Not applicable

Punto d’infiammabilità (°C)

Not applicable

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Certificati d'analisi (COA)

Lot/Batch Number
MKCQ6138
MKCQ4538
MKCQ4537
MKCP7039
MKCP4997

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Aguilar, M. et al.
Surface Science, 482-485, 935-935 (2001)

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