725544

四(乙基甲基胺基)铪(IV)

packaged for use in deposition systems

• 同義詞: TEMAH, 四(乙基甲基氨基)铪(IV)
• 線性公式: [(CH₃)(C₂H₅)N]₄Hf
• CAS號碼: 352535-01-4
• 分子量：: 410.90
• MDL號碼: MFCD03427130
• 分類程式碼代碼: 12352103
• PubChem物質ID: 329764168
• NACRES: NA.23

屬性

• 形狀: liquid
• 反應適用性: core: hafnium; reagent type: catalyst
• bp: 78 °C/0.01 mmHg (lit.)
• mp: <-50 °C
• 密度: 1.324 g/mL at 25 °C (lit.)
• 儲存溫度: 2-8°C
• SMILES 字串: CCN(C)[Hf](N(C)CC)(N(C)CC)N(C)CC
• InChI: 1S/4C3H8N.Hf/c4*1-3-4-2;/h4*3H2,1-2H3;/q4*-1;+4
• InChI 密鑰: NPEOKFBCHNGLJD-UHFFFAOYSA-N

描述

一般說明

Tetrakis(ethylmethylamido)hafnium(IV) (TEMAH) is a colorlessliquid, which freezes at -50 °C and boils around 78 °C at 0.1 Torr. It is air-and water-sensitive.

應用

Precursors Packaged for Depositions Systems

TEMAH is used as a precursor for atomic layer deposition(ALD) of conformal thin films of hafnium oxide (HfO₂) and hafnium zirconium oxide (Hf₁-xZrxO₂), which are used as dielectric films in semiconductor fabrication because of their high dielectric constants.

TEMAH is well-suited for ALD because its adsorption is self-limiting on a number of substrates including glass, indium-tin oxide(ITO), Si(100), and two-dimensional materials like MoS₂. TEMAH also conveniently reacts with either water or ozone as the oxygen-source in the ALD process.

特點和優勢

This TEMAH is packaged in a Swagelok stainless-steeldeposition system convenient for connecting to ALD systems.

• Steel cylinder connected to 316 stainless steelball-valve
• 1/4 inch male Swagelok VCR connections

安全資訊

• 象形圖: GHS02,GHS05,GHS07
• 訊號詞: Danger
• 危險聲明: H225,H260,H302,H314,H335
• 防範說明: P210 - P231 + P232 - P280 - P301 + P312 - P303 + P361 + P353 - P305 + P351 + P338
• 危險分類: Acute Tox. 4 Oral - Eye Dam. 1 - Flam. Liq. 2 - Skin Corr. 1B - STOT SE 3 - Water-react 1
• 標靶器官: Respiratory system
• 安全危害: EUH014
• 儲存類別代碼: 4.3 - Hazardous materials which set free flammable gases upon contact with water
• 水污染物質分類（WGK）: WGK 3
• 閃點（°F）: 51.8 °F - closed cup
• 閃點（°C）: 11 °C - closed cup