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重要文件

222011

Sigma-Aldrich

氯化铜(II)

97%

同義詞:

氯化铜

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About This Item

線性公式:
CuCl2
CAS號碼:
分子量::
134.45
EC號碼:
MDL號碼:
分類程式碼代碼:
12161600
PubChem物質ID:
NACRES:
NA.22

品質等級

化驗

97%

形狀

powder

反應適用性

core: copper
reagent type: catalyst

mp

620 °C (lit.)

密度

3.386 g/mL at 25 °C (lit.)

SMILES 字串

Cl[Cu]Cl

InChI

1S/2ClH.Cu/h2*1H;/q;;+2/p-2

InChI 密鑰

ORTQZVOHEJQUHG-UHFFFAOYSA-L

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應用

与钯一起通过环化过程催化合成 3-卤代吲哚。
氯化铜(II)可用于制备铜(II)-壳聚糖复合物,由于其细胞相容性和抗菌性,在生物医学装置中作为无抗生素抗菌生物材料具有潜在应用前景。
醇的四氢吡喃化的有效催化剂,条件温和和产率高。

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產品號碼
描述
訂價

訊號詞

Danger

危險分類

Acute Tox. 4 Dermal - Acute Tox. 4 Oral - Aquatic Acute 1 - Aquatic Chronic 2 - Eye Dam. 1 - Skin Irrit. 2

儲存類別代碼

8A - Combustible corrosive hazardous materials

水污染物質分類(WGK)

WGK 3

閃點(°F)

Not applicable

閃點(°C)

Not applicable

個人防護裝備

dust mask type N95 (US), Eyeshields, Gloves


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分析證明 (COA)

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Marcin H Kudzin et al.
Marine drugs, 18(12) (2020-12-30)
In recent years, due to an expansion of antibiotic-resistant microorganisms, there has been growing interest in biodegradable and antibacterial polymers that can be used in selected biomedical applications. The present work describes the synthesis of antimicrobial polylactide-copper alginate (PLA-ALG-Cu2+) composite
Manisha Kondiba Date et al.
Nanoscale research letters, 15(1), 45-45 (2020-02-20)
Three-dimensional (3D) CuO/TiO2 hybrid heterostructure nanorod arrays (NRs) with noble-metal-free composition, fabricated by template-assisted low-cost processes, were used as the photo-Fenton-like catalyst for dye degradation. Here, CuO NRs were deposited into anodic aluminum oxide templates by electrodeposition method annealed at
Synthesis, 1841-1841 (2007)
Lukas Gritsch et al.
Carbohydrate polymers, 179, 370-378 (2017-11-08)
We produced and characterized copper(II)-chitosan complexes fabricated via in-situ precipitation as antibiotic-free antibacterial biomaterials. Copper was bound to chitosan from a dilute acetic acid solution of chitosan and copper(II) chloride exploiting the ability of the polysaccharide to chelate metal ions.
Bhalerao, U.T. et al.
Synthetic Communications, 26, 3081-3081 (1996)

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