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形狀
crystalline (cubic (a = 5.4037))
wafer (single side polished)
不包含
dopant
直徑× 厚度
2 in. × 0.5 mm
bp
2355 °C (lit.)
mp
1410 °C (lit.)
密度
2.33 g/mL at 25 °C (lit.)
半導體屬性
<111>, N-type
SMILES 字串
[Si]
InChI
1S/Si
InChI 密鑰
XUIMIQQOPSSXEZ-UHFFFAOYSA-N
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應用
- 硅光子学和电子学:讨论硅光子学与电子学的集成,与开发高性能计算设备相关,与材料科学和高性能计算研究相(C Xiang et al., 2021。
- 硅硅 pi 单键:详细介绍了硅的结构化学及其在分子和材料科学中的含义,对关注硅在纳米技术和材料科学中的应用的化学家很有用(S Kyushin et al., 2020)。
物理性質
儲存類別代碼
13 - Non Combustible Solids
水污染物質分類(WGK)
nwg
閃點(°F)
Not applicable
閃點(°C)
Not applicable
個人防護裝備
Eyeshields, Gloves, type N95 (US)
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实验方案
Negative Photoresist Procedure
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