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品質等級
化驗
99.99% (Ti)
99.999% (Au)
直徑× 厚度
4 in. × 500 μm
層厚度
1000 Å
基質結合
Titanium, as adhesion layer used to bind the gold to the silicon wafer.
SMILES 字串
[Au]
InChI
1S/Au
InChI 密鑰
PCHJSUWPFVWCPO-UHFFFAOYSA-N
一般說明
钛粘附层，用于将金粘合到硅片 (100) 上。金取向名义上为具有 <111> 取向的高度多晶的。
Our gold-coated silicon wafers use electron-beam lithography to form amorphous layers (50Å of titanium followed by 1000Å of gold) on top of the silicon wafer.
應用
Gold coated silicon wafers may be used in soft lithography for micro and nanoscale patterning.
包裝
Packaging 1 set in single wafer shipper
儲存類別代碼
11 - Combustible Solids
水污染物質分類（WGK）
WGK 3
閃點（°F）
Not applicable
閃點（°C）
Not applicable
其他客户在看
Aguilar, M. et al.
Surface Science, 482-485, 935-935 (2001)
商品
1-Adamantanethiol (1-AD), an example in this spectrum of molecules with distinct chemical and physical properties, forms self-assembled monolayers (SAMs) on Au{111} that are displaceable when exposed to other thiolated molecules from solution, vapor, or contact due to weak intermolecular interactions in 1-AD SAMs.
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