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Documentos Principais

767484

Sigma-Aldrich

Nickel

sputtering target, diam. × thickness 2.00 in. × 0.25 in., 99.95% trace metals basis

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About This Item

Fórmula empírica (Notação de Hill):
Ni
Número CAS:
Peso molecular:
58.69
Número CE:
Número MDL:
Código UNSPSC:
11101706
ID de substância PubChem:
NACRES:
NA.23

Nível de qualidade

Ensaio

99.95% trace metals basis

Formulário

solid

adequação da reação

core: nickel

resistividade

6.97 μΩ-cm, 20°C

diâmetro × espessura

2.00 in. × 0.25 in.

p.e.

2732 °C (lit.)

pf

1453 °C (lit.)

densidade

8.9 g/mL at 25 °C (lit.)

cadeia de caracteres SMILES

[Ni]

InChI

1S/Ni

chave InChI

PXHVJJICTQNCMI-UHFFFAOYSA-N

Aplicação

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.

Pictogramas

Health hazardExclamation mark

Palavra indicadora

Danger

Frases de perigo

Classificações de perigo

Carc. 2 - Skin Sens. 1 - STOT RE 1

Código de classe de armazenamento

6.1D - Non-combustible acute toxic Cat.3 / toxic hazardous materials or hazardous materials causing chronic effects

Classe de risco de água (WGK)

WGK 2

Ponto de fulgor (°F)

Not applicable

Ponto de fulgor (°C)

Not applicable


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Sigma-Aldrich

268259

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