推薦產品
形狀
crystalline (cubic (a = 5.4037))
wafer
品質等級
包含
boron as dopant
直徑× 厚度
2 in. × 0.3 mm
bp
2355 °C (lit.)
mp
1410 °C (lit.)
密度
2.33 g/mL at 25 °C (lit.)
半導體屬性
<111>, P-type
SMILES 字串
[Si]
InChI
1S/Si
InChI 密鑰
XUIMIQQOPSSXEZ-UHFFFAOYSA-N
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物理性質
氧含量：≤ 1~1.8×1018/cm3；碳含量：≤ 5×1016/cm3；晶棒直径：1~8″
零涡旋缺陷。蚀坑密度 (EPD) < 100 (cm-2)。电阻率 10-3 - 40Ωcm
儲存類別代碼
13 - Non Combustible Solids
水污染物質分類（WGK）
WGK 2
閃點（°F）
Not applicable
閃點（°C）
Not applicable
個人防護裝備
Eyeshields, Gloves, type N95 (US)
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Journal of nanoscience and nanotechnology, 13(5), 3495-3499 (2013-07-19)
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Journal of nanoscience and nanotechnology, 13(5), 3397-3402 (2013-07-19)
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Journal of nanoscience and nanotechnology, 13(5), 3559-3563 (2013-07-19)
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Journal of nanoscience and nanotechnology, 13(4), 2451-2460 (2013-06-15)
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Si-nanowire-array-based NOT-logic circuits constructed on plastic substrates using top-down methods.
Youngin Jeon et al.
Journal of nanoscience and nanotechnology, 13(5), 3350-3353 (2013-07-19)
Si-nanowire (NW)-array-based NOT-logic circuits were constructed on plastic substrates. The Si-NW arrays were fabricated on a Si wafer through top-down methods, including conventional photolithography and crystallographic wet etching, and transferred onto the plastic substrates. Two field-effect transistors were fabricated on
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Negative Photoresist Procedure
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