推薦產品
化驗
99.99% trace metals basis
形狀
solid
雜質
≤150.0 ppm Trace Metal Analysis
mp
105 °C (dec.) (lit.)
密度
2.67 g/mL at 25 °C (lit.)
SMILES 字串
[K+].[K+].Cl[Pd--](Cl)(Cl)Cl
InChI
1S/4ClH.2K.Pd/h4*1H;;;/q;;;;2*+1;+2/p-4
InChI 密鑰
LGCKLDWLSVFMGL-UHFFFAOYSA-J
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應用
用于合成含半导体金属的聚合物,其中聚吡咯骨架的构象能量最小并且几乎是平面结构。
特點和優勢
用于合成半导电的含金属聚合物,在聚合物中聚吡咯主链具有最低的构象能,并且几乎成平面。与双二硫醇盐反应生成金属-双二硫醇盐,可用于激光器 Q 开关材料、光盘记录介质、条形码材料和超导体。
訊號詞
Warning
危險聲明
危險分類
Eye Irrit. 2 - Skin Irrit. 2 - STOT SE 3
標靶器官
Respiratory system
儲存類別代碼
11 - Combustible Solids
水污染物質分類(WGK)
WGK 3
閃點(°F)
Not applicable
閃點(°C)
Not applicable
個人防護裝備
dust mask type N95 (US), Eyeshields, Gloves
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