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267481

Sigma-Aldrich

钛

foil, thickness 0.25 mm, 99.99% trace metals basis

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About This Item

經驗公式（希爾表示法）:
Ti
CAS號碼:
7440-32-6
分子量：:
47.87
EC號碼:
231-142-3
MDL號碼:
MFCD00011264
分類程式碼代碼:
12141746
PubChem物質ID:
24856227
NACRES:
NA.23

品質等級

100

化驗

99.99% trace metals basis

形狀

foil

自燃溫度

860 °F

電阻係數

42.0 μΩ-cm, 20°C

厚度

0.25 mm

bp

3287 °C (lit.)

mp

1660 °C (lit.)

密度

4.5 g/mL at 25 °C (lit.)

應用

battery manufacturing

SMILES 字串

[Ti]

InChI

1S/Ti

InChI 密鑰

RTAQQCXQSZGOHL-UHFFFAOYSA-N

一般說明

Ti has low thermal and electrical conductivity. It is highly corrosion-resistant and has a high strength to weight ratio. A few angstroms thick layer of titania on the surface of Ti products makes its corrosion resistant.5 Ti foils could be employed as a substrate to grow arrays of hematite nanorods by hydrothermal method. A study reports pressure less sintering of SiC pieces and single crystals to Ti foils at 1500oC.Ti foil may be applied as an interlayer, diffusion bonded during the self joining of Si3N4. Si3N4/Ti-foil/Si3N4.

數量

700mg = 25×25mm；2.8g = 50×50mm

儲存類別代碼

11 - Combustible Solids

水污染物質分類（WGK）

nwg

閃點（°F）

Not applicable

閃點（°C）

Not applicable

個人防護裝備

Eyeshields, Gloves, type N95 (US)

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分析證明 (COA)

Lot/Batch Number
MKCQ3815
MKCM1141
MKCG4564
MKCF6241
MKCF3687

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乙二醇 anhydrous, 99.8%

Sigma-Aldrich

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乙二醇

Bonding mechanism between silicon carbide and thin foils of reactive metals
Morozumi S, et al.
J. Mater. Sci., 20(11), 3976-3982 (1985)
Joining of silicon nitride with a titanium foil interlayer
Lemus J and Drew RAL
Materials Science & Engineering. A, Structural Materials : Properties, Microstructure and Processing, 352, 169-178 (2003)
Large-Scale Porous Hematite Nanorod Arrays: Direct Growth on Titanium Foil and Reversible Lithium Storage.
Song Y et al.
The Journal of Physical Chemistry C, 114(49), 21158-21164 (2010)
A Kurbad et al.
International journal of computerized dentistry, 16(2), 125-141 (2013-08-13)
This article presents two novel options for lithium-disilicate restorations supported by single-tooth implants. By using a Ti-Base connector, hybrid abutments and hybrid abutment crowns can be fabricated for different implant systems. The latter option in particular is an interesting new
J H Kim et al.
Journal of nanoscience and nanotechnology, 13(7), 4601-4607 (2013-08-02)
Nanocytalline TiN films were deposited on non-alkali glass and Al substrates by reactive DC magnetron sputtering (DCMS) with an electromagnetic field system (EMF). The microstructure and corrosion resistance of the TiN-coated Al substrates were estimated by X-ray diffraction (XRD), scanning
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