Skip to Content
Merck
All Photos(1)

Key Documents

More Documents

575801

Sigma-Aldrich

Poly(pyromellitic dianhydride-co-4,4′-oxydianiline), amic acid solution

15.0-16.0 wt. % in NMP

Synonym(s):

Pyre-M.L.® RC-5019, Polyamic acid

Sign Into View Organizational & Contract Pricing
All Photos(1)

About This Item

Linear Formula:
(C12H12N2O .C10H2O6)x
UNSPSC Code:
12162002
NACRES:
NA.23

Quality Level

100

concentration

15.0-16.0 wt. % in NMP

refractive index

n20/D 1.507

viscosity

50-70 poise

density

1.166 g/mL at 25 °C

storage temp.

−20°C

Looking for similar products? Visit Product Comparison Guide

Related Categories

Application

  • Synthesis of nano-polyimide for microelectronic applications: This study discusses the synthesis processes from Poly (amic acid) (PAA) of poly (pyromellitic dianhydride-co-4,4′-oxydianiline) and its applications in microelectronics, highlighting its potential in advanced fabrication techniques (Ebnalwaled et al., 2016).

Legal Information

Pyre-M.L. is a registered trademark of Industrial Summit Technologies Corp.

Pictograms

Exclamation markHealth hazard
GHS07,GHS08

Signal Word

Danger

Hazard Classifications

Eye Irrit. 2 - Repr. 1B - Skin Irrit. 2 - STOT SE 3

Target Organs

Respiratory system

Storage Class Code

6.1C - Combustible, acute toxic Cat.3 / toxic compounds or compounds which causing chronic effects

WGK

WGK 1

Certificates of Analysis (COA)

Search for Certificates of Analysis (COA) by entering the products Lot/Batch Number. Lot and Batch Numbers can be found on a product’s label following the words ‘Lot’ or ‘Batch’.

Already Own This Product?

Find documentation for the products that you have recently purchased in the Document Library.

Visit the Document Library

Manuela Loeblein et al.
Small (Weinheim an der Bergstrasse, Germany), 11(48), 6425-6434 (2015-10-21)
Polyimides (PIs) have been praised for their high thermal stability, high modulus of elasticity and tensile strength, ease of fabrication, and moldability. They are currently the standard choice for both substrates for flexible electronics and space shielding, as they render
Nurit Atar et al.
ACS applied materials & interfaces, 7(22), 12047-12056 (2015-05-07)
In low Earth orbit (LEO), hazards such as atomic oxygen (AO) or electrostatic discharge (ESD) degrade polymeric materials, specifically, the extensively used polyimide (PI) Kapton. We prepared PI-based nanocomposite films that show both AO durability and ESD protection by incorporating

Our team of scientists has experience in all areas of research including Life Science, Material Science, Chemical Synthesis, Chromatography, Analytical and many others.

Contact Technical Service