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Key Documents

767514

Sigma-Aldrich

Tantalum

sputtering target, diam. × thickness 2.00 in. × 0.25 in., 99.95% trace metals basis

동의어(들):

Ta

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About This Item

실험식(Hill 표기법):
Ta
CAS Number:
Molecular Weight:
180.95
EC Number:
MDL number:
UNSPSC 코드:
12352103
PubChem Substance ID:
NACRES:
NA.23

vapor pressure

<0.01 mmHg ( 537.2 °C)

분석

99.95% trace metals basis

형태

foil

autoignition temp.

572 °F

반응 적합성

core: tantalum

저항도

13.5 μΩ-cm, 20°C

직경 × 두께

2.00 in. × 0.25 in.

bp

5425 °C (lit.)

mp

2996 °C (lit.)

density

16.69 g/cm3 (lit.)

SMILES string

[Ta]

InChI

1S/Ta

InChI key

GUVRBAGPIYLISA-UHFFFAOYSA-N

애플리케이션

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.

Storage Class Code

11 - Combustible Solids

WGK

nwg

Flash Point (°F)

Not applicable

Flash Point (°C)

Not applicable


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J Black
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Jian Lu et al.
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