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Key Documents

767484

Sigma-Aldrich

Nickel

sputtering target, diam. × thickness 2.00 in. × 0.25 in., 99.95% trace metals basis

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About This Item

실험식(Hill 표기법):
Ni
CAS Number:
Molecular Weight:
58.69
EC Number:
MDL number:
UNSPSC 코드:
12352103
PubChem Substance ID:
NACRES:
NA.23

Quality Level

분석

99.95% trace metals basis

형태

solid

반응 적합성

core: nickel

저항도

6.97 μΩ-cm, 20°C

직경 × 두께

2.00 in. × 0.25 in.

bp

2732 °C (lit.)

mp

1453 °C (lit.)

density

8.9 g/mL at 25 °C (lit.)

SMILES string

[Ni]

InChI

1S/Ni

InChI key

PXHVJJICTQNCMI-UHFFFAOYSA-N

애플리케이션

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.

픽토그램

Health hazardExclamation mark

신호어

Danger

유해 및 위험 성명서

Hazard Classifications

Carc. 2 - Skin Sens. 1 - STOT RE 1

Storage Class Code

6.1D - Non-combustible acute toxic Cat.3 / toxic hazardous materials or hazardous materials causing chronic effects

WGK

WGK 2

Flash Point (°F)

Not applicable

Flash Point (°C)

Not applicable


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