643262

Gold coated silicon wafer

99.999% (Au), layer thickness 1000 Å, 99.99% (Ti)

• 동의어(들): gold coated silicon, gold coated wafer
• Linear Formula: Au
• Molecular Weight: 196.97
• MDL number: MFCD00003436
• UNSPSC 코드: 12352103
• PubChem Substance ID: 329759955
• NACRES: NA.23

속성

• 분석: 99.99% (Ti); 99.999% (Au)
• 직경 × 두께: 4 in. × 500 μm
• 레이어 두께: 1000 Å
• 기질 부착: Titanium, as adhesion layer used to bind the gold to the silicon wafer.
• SMILES string: [Au]
• InChI: 1S/Au
• InChI key: PCHJSUWPFVWCPO-UHFFFAOYSA-N

설명

일반 설명

Our gold-coated silicon wafers use electron-beam lithography to form amorphous layers (50Å of titanium followed by 1000Å of gold) on top of the silicon wafer.

The product is highly crystalline, with <111> orientation gold and <100> orientation silicon wafer is used. Titanium is used as an adhesion layer to bind gold to the silicon wafer.

애플리케이션

Gold coated silicon wafers may be used in soft lithography for micro and nanoscale patterning.

포장

Packaging 1 set in single wafer shipper

안전성 정보

• Storage Class Code: 11 - Combustible Solids
• WGK: WGK 3
• Flash Point (°F): Not applicable
• Flash Point (°C): Not applicable