추천 제품
Quality Level
분석
97%
양식
liquid
refractive index
n20/D 1.541 (lit.)
bp
150 °C/748 mmHg (lit.)
density
0.957 g/mL at 25 °C (lit.)
SMILES string
C1Cc2ccccc12
InChI
1S/C8H8/c1-2-4-8-6-5-7(8)3-1/h1-4H,5-6H2
InChI key
UMIVXZPTRXBADB-UHFFFAOYSA-N
애플리케이션
Benzocyclobutene was used as the adhesive bonding material in adhesive wafer-level bonding technique. Photosensitive benzocyclobutene has been widely used as dielectric material in multilayer packaging applications. It was used in fabrication of high density multilayer interconnect structures using gold metallization and polymer interlayer dielectric.
신호어
Warning
유해 및 위험 성명서
Hazard Classifications
Flam. Liq. 3
Storage Class Code
3 - Flammable liquids
WGK
WGK 3
Flash Point (°F)
96.8 °F - closed cup
Flash Point (°C)
36 °C - closed cup
개인 보호 장비
Eyeshields, Faceshields, Gloves, type ABEK (EN14387) respirator filter
Photosensitive benzocyclobutene for stress-buffer and passivation applications (one mask manufacturing process).
Strandjord AJG, et al.
Electronic Components and Technology Conference, 1997. Proceedings., 47th. IEEE, 47 (1997)
Processing and microwave characterization of multilevel interconnects using benzocyclobutene dielectric.
Chinoy PB and Tajadod J.
IEEE Transactions on Components, Hybrids, and Manufacturing, 16(7), 714-719 (1993)
Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities.
Oberhammer J, et al.
Sens. Actuators, 105(3), 297-304 (2003)
자사의 과학자팀은 생명 과학, 재료 과학, 화학 합성, 크로마토그래피, 분석 및 기타 많은 영역을 포함한 모든 과학 분야에 경험이 있습니다..
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