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形狀
powder
品質等級
粒徑
<3 μm
mp
2930 °C (lit.)
密度
5.24 g/mL at 25 °C (lit.)
SMILES 字串
N#[Ti]
InChI
1S/N.Ti
InChI 密鑰
NRTOMJZYCJJWKI-UHFFFAOYSA-N
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儲存類別代碼
13 - Non Combustible Solids
水污染物質分類(WGK)
WGK 3
閃點(°F)
Not applicable
閃點(°C)
Not applicable
個人防護裝備
Eyeshields, Gloves, type N95 (US)
其他客户在看
Materials (Basel, Switzerland), 13(5) (2020-03-04)
In this work, two kinds of silicon nitride-based composites, namely, those with titanium nitride or silicon carbide additives, were sintered using the hot pressing technique (HP). The phase composition, microstructure, and mechanical and elastic properties of the materials were characterized.
Materials (Basel, Switzerland), 12(3) (2019-02-13)
The Ti-6Al-4V alloy is widely used in the manufacture of components that must have low density and high corrosion resistance and fatigue strength. The fatigue strength can be improved by surface modification. The aim of this study was to determine
Analytica chimica acta, 753, 32-41 (2012-10-31)
A novel, simple and facile layer by layer (LBL) approach is used for modification of glassy carbon (GC) electrode with multilayer of catalase and nanocomposite containing 1-(3-Aminopropyl)-3-methylimidazolium bromide (amine terminated ionic liquid (NH(2)-IL)) and titanium nitride nanoparticles (TiNnp). First a
Journal of materials science. Materials in medicine, 23(12), 2953-2966 (2012-08-25)
In this study, the new Hardion+ micro-implanter technology was used to modify surface properties of biomedical pure titanium (CP-Ti) and Ti-6Al-4V ELI alloy by implantation of nitrogen ions. This process is based on the use of an electron cyclotron resonance
Journal of the mechanical behavior of biomedical materials, 6, 9-20 (2012-02-04)
The purpose of this first generation investigation is to evaluate fabrication, in vitro cytotoxicity, cell-material interactions and tribological performance of TiN particle reinforced Ti6Al4V composite coatings for potential wear resistant load bearing implant applications. The microstructural analysis of the composites
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As the electronic industry continues to move towards smaller and smaller devices, researchers must continually strive for technologies to deposit electronic materials with precision at ever-smaller scales. This trend has lead to a variety of techniques used in the microelectronics industry to layer materials with precision thicknesses, sometimes down to even the atomic level.
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