667498

Tungsten etchant

• Sinônimo(s): Tungsten etch
• Número MDL: MFCD08705365
• Código UNSPSC: 12352300
• NACRES: NA.23

Propriedades

• Nível de qualidade: 100

Descrição

Descrição geral

Tungsten etchant is a mixture of potassium hydroxide and potassium ferricyanide based solution that facilitates the removal of tungsten and other materials like aluminium by dipping the substrate into the etching solution.

Aplicação

Selective etchants for tungsten thin-film metallizations used in semiconductor and microelectronics technology. Etchants are buffered, mildly alkaline ferricyanide-based formulations providing high resolution patterns with minimal undercutting and photoresist compatibility. Etchant is ready to use (no dilution required). Controlled, uniform etching is achieved by immersion or spray etch technique. Etch Capacity (rate declines at ∼70%) of 64 g/gallon. Recommended Operating Temperatures: 20-80 °C (30-40 °C most common).

Nota de preparo

1. Select your etching method according to the table belowEtch Rate (Immersion) Etch Rate (Spray)

• 20°C = 30 Å/second
• 30°C = 140 Å/second 20°C = 80 Å/second
• 60°C = 250 Å/second

2. Rinse with DI water

Informações de segurança

• Pictogramas: GHS05
• Palavra indicadora: Danger
• Frases de perigo: H290,H314,H412
• Declarações de precaução: P234 - P273 - P280 - P303 + P361 + P353 - P304 + P340 + P310 - P305 + P351 + P338
• Classificações de perigo: Aquatic Chronic 3 - Eye Dam. 1 - Met. Corr. 1 - Skin Corr. 1A
• Perigos de suplementos: EUH032
• Código de classe de armazenamento: 8B - Non-combustible corrosive hazardous materials
• Classe de risco de água (WGK): WGK 2
• Ponto de fulgor (°F): Not applicable
• Ponto de fulgor (°C): Not applicable
• Equipamento de proteção individual: Faceshields, Gloves, Goggles, type ABEK (EN14387) respirator filter