901621

Buffered oxide etchant (BOE) 10:1

• Synonym(e): BHF, Buffered HF
• UNSPSC-Code: 12161700
• NACRES: NA.23

Eigenschaften

• Form: liquid

Beschreibung

Allgemeine Beschreibung

Buffered oxide etchant (BOE) is a wet etchant used in microfabrication. Its primary use is in etching thin films of silicon dioxide (SiO₂) or silicon nitride (Si₃N₄). It is a mixture of a buffering agent, such as ammonium fluoride (NH₄F), and hydrofluoric acid (HF). Concentrated HF etches silicon dioxide too quickly for good process control and also peels photoresist used in lithographic patterning.

Anwendung

Buffered oxide etchant (BOE) 10:1 can be used in the etching of titanium carbide, which can be used in microelectromechanical systems (MEMS). It can also be used in the etching of spin-on-dopant (SOD) for the development of conductor-insulator-conductor tunneling diodes. It can also be used to enhance the surface of fused quartz devices.

Sicherheitshinweise

• Piktogramme: GHS06,GHS05
• Signalwort: Danger
• H-Sätze: H301 + H331,H310,H314
• P-Sätze: P261 - P271 - P280 - P303 + P361 + P353 - P304 + P340 + P310 - P305 + P351 + P338
• Gefahreneinstufungen: Acute Tox. 2 Dermal - Acute Tox. 3 Inhalation - Acute Tox. 3 Oral - Eye Dam. 1 - Skin Corr. 1B
• Lagerklassenschlüssel: 6.1B - Non-combustible acute toxic Cat. 1 and 2 / very toxic hazardous materials
• WGK: WGK 2
• Flammpunkt (°F): Not applicable
• Flammpunkt (°C): Not applicable