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About This Item
Empirical Formula (Hill Notation):
Cu
CAS Number:
Molecular Weight:
63.55
EC Number:
MDL number:
UNSPSC Code:
11101604
PubChem Substance ID:
NACRES:
NA.23
Recommended Products
Quality Level
Assay
98%
form
powder (spheroidal)
resistivity
1.673 μΩ-cm, 20°C
particle size
10-25 μm
bp
2567 °C (lit.)
mp
1083.4 °C (lit.)
density
8.94 g/mL at 25 °C (lit.)
SMILES string
[Cu]
InChI
1S/Cu
InChI key
RYGMFSIKBFXOCR-UHFFFAOYSA-N
General description
Copper powder is a metal based powder that can be produced by electrolytic and non-electrolytic techniques. These processes include spray pyrolysis, chemical reduction in the presence of reducing agents, solvothermal and hydrometallurgical methods, and atomization.
Application
Copper (Cu) based powder can be used for a wide range of industrial applications. Its electrical properties and thermal characteristics make it useful in the development of electronic and electrical devices. It can also be used for self-lubricated bearings, brazing, mechanical plating, and cold soldering.
Signal Word
Danger
Hazard Statements
Precautionary Statements
Hazard Classifications
Aquatic Acute 1 - Aquatic Chronic 1 - Flam. Sol. 1
Storage Class Code
4.1B - Flammable solid hazardous materials
WGK
WGK 2
Flash Point(F)
Not applicable
Flash Point(C)
Not applicable
Personal Protective Equipment
dust mask type N95 (US), Eyeshields, Gloves
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