推薦產品
品質等級
化驗
99.98% trace metals basis
形狀
foil
電阻係數
1.673 μΩ-cm, 20°C
厚度
0.25 mm
bp
2567 °C (lit.)
mp
1083.4 °C (lit.)
密度
8.94 g/mL at 25 °C (lit.)
應用
battery manufacturing
SMILES 字串
[Cu]
InChI
1S/Cu
InChI 密鑰
RYGMFSIKBFXOCR-UHFFFAOYSA-N
一般說明
铜箔厚度为 0.25 毫米，含有 99.98% 的微量金属，是一种高质量的产品，具有众多的工业和商业应用。它采用尖端的制造工艺生产，确保卓越的质量和一致性。箔经过仔细检查，以满足指定的纯度水平，杜绝任何缺陷，如划痕、凹痕和撕裂。铜箔是一种非常通用的材料，提供卓越的导电性、导热性和耐腐蚀性。
應用
铜箔通常用于各种应用，如印刷电路板（PCB）、电磁屏蔽，并作为化学气相沉积的衬底。0.25 毫米厚度的这种箔使其适用于许多应用，提供足够的强度和耐用性，同时保持易于处理和操作。99.98% 的痕量金属确保了铜箔的最高质量，只有最低水平的杂质，如铅、砷和铋。这种纯度水平对于许多工业应用至关重要，特别是在电子工业中，即使少量的杂质也会显著影响最终产品的性能和可靠性。
數量
50 × 50 mm（约 5.5 g）
150 × 150 mm（约 49.5g）
150 × 150 mm（约 49.5g）
儲存類別代碼
13 - Non Combustible Solids
水污染物質分類（WGK）
WGK 2
閃點（°F）
Not applicable
閃點（°C）
Not applicable
個人防護裝備
Eyeshields, Gloves, type N95 (US)
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文章
Can there be an effective strategy for finding breakthrough materials, since they are, by definition, unpredictable? One answer is found in Combinatorial Materials Science techniques, which represent a powerful approach to identifying new and unexpected materials.
我們的科學家團隊在所有研究領域都有豐富的經驗，包括生命科學、材料科學、化學合成、色譜、分析等.
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