575801
Poly(pyromellitic dianhydride-co-4,4′-oxydianiline), amic acid solution
15.0-16.0 wt. % in NMP
Synonym(s):
Pyre-M.L.® RC-5019, Polyamic acid
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About This Item
Linear Formula:
(C12H12N2O .C10H2O6)x
UNSPSC Code:
12162002
NACRES:
NA.23
Recommended Products
concentration
15.0-16.0 wt. % in NMP
refractive index
n20/D 1.507
viscosity
50-70 poise
density
1.166 g/mL at 25 °C
storage temp.
−20°C
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Application
- Synthesis of nano-polyimide for microelectronic applications: This study discusses the synthesis processes from Poly (amic acid) (PAA) of poly (pyromellitic dianhydride-co-4,4′-oxydianiline) and its applications in microelectronics, highlighting its potential in advanced fabrication techniques (Ebnalwaled et al., 2016).
Legal Information
Pyre-M.L. is a registered trademark of Industrial Summit Technologies Corp.
Signal Word
Danger
Hazard Statements
Precautionary Statements
Hazard Classifications
Eye Irrit. 2 - Repr. 1B - Skin Irrit. 2 - STOT SE 3
Target Organs
Respiratory system
Storage Class Code
6.1C - Combustible acute toxic Cat.3 / toxic compounds or compounds which causing chronic effects
WGK
WGK 1
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Manuela Loeblein et al.
Small (Weinheim an der Bergstrasse, Germany), 11(48), 6425-6434 (2015-10-21)
Polyimides (PIs) have been praised for their high thermal stability, high modulus of elasticity and tensile strength, ease of fabrication, and moldability. They are currently the standard choice for both substrates for flexible electronics and space shielding, as they render
Nurit Atar et al.
ACS applied materials & interfaces, 7(22), 12047-12056 (2015-05-07)
In low Earth orbit (LEO), hazards such as atomic oxygen (AO) or electrostatic discharge (ESD) degrade polymeric materials, specifically, the extensively used polyimide (PI) Kapton. We prepared PI-based nanocomposite films that show both AO durability and ESD protection by incorporating
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