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Key Documents

W351407

Sigma-Aldrich

1,8-Octanedithiol

≥97%, FG

Synonym(s):

1,8-Dimercaptooctane

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About This Item

Linear Formula:
HS(CH2)8SH
CAS Number:
Molecular Weight:
178.36
FEMA Number:
3514
EC Number:
Council of Europe no.:
2331
MDL number:
UNSPSC Code:
12164502
PubChem Substance ID:
Flavis number:
12.034
NACRES:
NA.21
Organoleptic:
meaty; sulfurous
grade:
FG
Kosher
biological source:
synthetic
food allergen:
no known allergens

biological source

synthetic

Quality Level

grade

FG
Kosher

reg. compliance

EU Regulation 1334/2008 & 872/2012

Assay

≥97%

refractive index

n20/D 1.505 (lit.)

bp

269-270 °C (lit.)

density

0.97 g/mL at 25 °C (lit.)

application(s)

flavors and fragrances

Documentation

see Safety & Documentation for available documents

food allergen

no known allergens

Organoleptic

meaty; sulfurous

SMILES string

SCCCCCCCCS

InChI

1S/C8H18S2/c9-7-5-3-1-2-4-6-8-10/h9-10H,1-8H2

InChI key

PGTWZHXOSWQKCY-UHFFFAOYSA-N

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General description

1,8-Octanedithiol is a volatile sulfur-containing flavoring agent with a meaty, sulfurous odor.

Pictograms

Exclamation mark

Signal Word

Warning

Hazard Statements

Hazard Classifications

Acute Tox. 4 Oral

Storage Class Code

10 - Combustible liquids

WGK

WGK 3

Flash Point(F)

235.4 °F - closed cup

Flash Point(C)

113 °C - closed cup

Personal Protective Equipment

dust mask type N95 (US), Eyeshields, Gloves

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Fenaroli's Handbook of Flavor Ingredients, 1523-1523 (2016)
The role of sulfur compounds in food flavor part III: Thiols.
Maga JA & Katz I.
Critical Reviews in Food Science and Nutrition, 7(2), 147-192 (1976)
Nidhi Shah et al.
ACS nano, 9(10), 10278-10286 (2015-09-08)
Here we describe the electrodeposition of Ag in the presence of cetyltrimethylammonium bromide (CTAB) onto 5 μm gap Au interdigitated array (IDA) electrodes that are bare, thiol-functionalized, or thiol-functionalized and seeded with 4 nm diameter Au nanoparticles (NPs). After deposition
Jin Yeong Na et al.
Scientific reports, 5, 13288-13288 (2015-08-25)
Spin-coating has been used extensively in the fabrication of electronic devices; however, the effects of the processing parameters have not been fully explored. Here, we systematically characterize the effects of the spin-coating time on the microstructure evolution during semiconducting polymer

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