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Sigma-Aldrich

Tetrakis(ethylmethylamido)hafnium(IV)

≥99.99% trace metals basis

Synonym(s):

TEMAH, Tetrakis(ethylmethylamino)hafnium(IV)

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About This Item

Linear Formula:
[(CH3)(C2H5)N]4Hf
CAS Number:
Molecular Weight:
410.90
MDL number:
UNSPSC Code:
12352300
PubChem Substance ID:
NACRES:
NA.23

Quality Level

Assay

≥99.99% trace metals basis

form

liquid

reaction suitability

core: hafnium

impurities

Purity excludes ~2000 ppm Zirconium

bp

78 °C/0.01 mmHg (lit.)

mp

<-50 °C

density

1.324 g/mL at 25 °C (lit.)

SMILES string

CCN(C)[Hf](N(C)CC)(N(C)CC)N(C)CC

InChI

1S/4C3H8N.Hf/c4*1-3-4-2;/h4*3H2,1-2H3;/q4*-1;+4

InChI key

NPEOKFBCHNGLJD-UHFFFAOYSA-N

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General description

Tetrakis(ethylmethylamido)hafnium(IV) (TEMAH) is a colorlessliquid that is sensitive to water and air. It freezes at -50 °C and boilsaround 78 °C at 0.1 Torr.

Application

TEMAH is used as a precursor for atomic layer deposition (ALD)of hafnium oxide (HfO2) thin films. Because HfO2 has a high dielectric constant of 16-25, it is commonly used as a dielectric film in semiconductor fabrication.

TEMAH is ideal for ALD because of its low boiling point and its reactivity with water and ozone. Most importantly, its adsorption is self-limiting on a number of substrates including glass, indium-tin oxide(ITO), and Si(100). Researchers have also used it to deposit thin films ofHfO2 on 2D materials, like MoS2.


TEMAH is also useful precursor in the synthesis of ferroelectric hafnium zirconium oxide and Hf1-xZrxO2 thin films on MoS2 phototransistors. Researchers have also deposited thin films of hafnium nitride (Hf3N4) by ALD alternatively pulsing TEMAH and ammonia.

Features and Benefits

  • Thermally stable.
  • It has sufficient volatility and is suitable for use in vapor deposition.
  • Completely self-limiting surface reactions.

Signal Word

Danger

Hazard Classifications

Acute Tox. 4 Oral - Eye Dam. 1 - Flam. Liq. 2 - Skin Corr. 1B - STOT SE 3 - Water-react 1

Target Organs

Respiratory system

Supplementary Hazards

Storage Class Code

4.3 - Hazardous materials, which set free flammable gases upon contact with water

WGK

WGK 3

Flash Point(F)

51.8 °F - closed cup

Flash Point(C)

11 °C - closed cup

Personal Protective Equipment

dust mask type N95 (US), Eyeshields, Gloves

Certificates of Analysis (COA)

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