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266922

Sigma-Aldrich

Molybdenum

foil, thickness 0.1 mm, ≥99.9% trace metals basis

Synonym(s):

Molybdenum element

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About This Item

Empirical Formula (Hill Notation):
Mo
CAS Number:
Molecular Weight:
95.94
EC Number:
MDL number:
UNSPSC Code:
12141727
PubChem Substance ID:
NACRES:
NA.23

Quality Level

Assay

≥99.9% trace metals basis

form

foil

resistivity

5.0 μΩ-cm, 20°C

thickness

0.1 mm

bp

4612 °C (lit.)

mp

2617 °C (lit.)

density

10.3 g/mL at 25 °C (lit.)

SMILES string

[Mo]

InChI

1S/Mo

InChI key

ZOKXTWBITQBERF-UHFFFAOYSA-N

General description

Mo foils are lightweight and flexible, hence desirable for space applications. Mo foil may be used as a substrate for the fabrication of CdS-CdTe solar cells. Interaction of selenium, arsenic hydrides, stibine and bismuthine with Mo foil was investigated by atomic absorption spectroscopy. Mo foils may be used to generate metal diffusion bonding in silicon carbide/silicon carbide (SiC/SiC) joints.

Quantity

100×100 mm (approximately 10.2 g)

Storage Class Code

13 - Non Combustible Solids

WGK

nwg

Flash Point(F)

Not applicable

Flash Point(C)

Not applicable

Personal Protective Equipment

dust mask type N95 (US), Eyeshields, Gloves

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Design issues in the fabrication of CdS?CdTe solar cells on molybdenum foil substrates.
Singh VP and McClure JC
Solar Energy Materials and Solar Cells, 76, 363-385 (2003)
Trapping of hydride forming elements within miniature electrothermal devices: part I. investigation of collection of arsenic and selenium hydrides on a molybdenum foil strip
Docekal B and Selecka A
Spectrochimica Acta. Part B: Atomic Spectroscopy, 59(4), 487-495 (2004)
Trapping of hydride forming elements within miniature electrothermal devices. Part 3. Investigation of collection of antimony and bismuth on a molybdenum foil strip following hydride generation
Krejci P, et al.
Spectrochimica Acta. Part B: Atomic Spectroscopy, 61, 444-449 (2006)
Flexural Strength and Shear Strength of Silicon Carbide to Silicon Carbide Joints Fabricated by a Molybdenum Diffusion Bonding Technique.
Cockeram BV, et al.
Journal of the American Ceramic Society. American Ceramic Society, 88(7), 1892-1899 (2006)
Elena Vigonsky et al.
Proceedings of the National Academy of Sciences of the United States of America, 110(14), 5440-5445 (2013-03-21)
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