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651818

Sigma-Aldrich

Gold etchant, standard

Synonym(s):

Antistrumin, Potassium monoiodide

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About This Item

CAS Number:
7681-11-0
MDL number:
MFCD07370792
UNSPSC Code:
12352300
NACRES:
NA.23

composition

volatiles, 50-80%

Quality Level

100

bp

100 °C (lit.)
100 °C/1 atm

solubility

H2O: miscible

density

1.2924 g/mL at 25 °C (lit.)

InChI

1S/HI.K/h1H;/q;+1/p-1

InChI key

NLKNQRATVPKPDG-UHFFFAOYSA-M

Related Categories

General description

Etching readily controlled with minimum undercutting. Room temperature operated. Cyanide-free for standard applications. Etch rate of 28 angstrom/sec @ 25 °C.
Gold etchant is a combination of potassium iodide and iodine as complexing agents synthesized by electrochemically oxidizing gold.

Application

Gold etchant is a selective general-purpose etchant for gold, compatible with negative and positive photoresists. It is used to etch out gold (Au) electrodes prior to scanning electron microscopy (SEM) imaging for morphological study and metal layer for the preparation of nanoelectrodes array. Gold etchant can also be used in metal assisted chemical etching (MACE) for the fabrication of p-n junction silicon nanopillar based solar cells.

Pictograms

Health hazard
GHS08

Signal Word

Danger

Hazard Statements

H372

Precautionary Statements

P260 - P264 - P270 - P314 - P501

Hazard Classifications

STOT RE 1 Oral

Target Organs

Thyroid

Storage Class Code

6.1D - Non-combustible, acute toxic Cat.3 / toxic hazardous materials or hazardous materials causing chronic effects

WGK

WGK 3

Flash Point(F)

Not applicable

Flash Point(C)

Not applicable

Personal Protective Equipment

dust mask type N95 (US), Eyeshields, Gloves

Certificates of Analysis (COA)

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A two-step annealing process for enhancing the ferroelectric properties of poly (vinylidene fluoride)(PVDF) devices.
Park H, et al.
Journal of Material Chemistry C, 3(10), 2366-2370 (2015)
Cyanide-and thiourea-free electrochemical etching of gold for microelectronics applications.
Hu Z and Ritzdorf T
Journal of the Electrochemical Society, 154(10), D543-D549 (2007)
High performance nanopillars array silicon solar cells.
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 117(10), 1-5 (2013)
Abhinav Sharma et al.
Scientific reports, 9(1), 5970-5970 (2019-04-14)
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Protocols

Negative Photoresist Procedure

Our photoresist kit was designed to have the necessary chemical components for each step in the lithographic process. The component materials are provided in pre-weighed quantities for your convenience. Etchants are available separately so that the proper etchant can be chosen for a variety of substrate choices.

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