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911623

Sigma-Aldrich

2-(2,4-Difluorophenyl)-5-methoxypyridine

≥95%

Synonym(s):

dF(OMe)ppy

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About This Item

Empirical Formula (Hill Notation):
C12H9F2NO
CAS Number:
1809322-55-1
Molecular Weight:
221.20
UNSPSC Code:
12352101

Assay

≥95%

form

powder

reaction suitability

reaction type: Photocatalysis
reagent type: catalyst

mp

79-81 °C

Application

2-(2,4-Difluorophenyl)-5-methoxypyridine is a ligand used for the preparation of Ir(III) photocatalysts.

Product can be used with our line of photoreactors: Including Penn PhD (Z744035) & SynLED 2.0 (Z744080)

Other Notes

Fragment Couplings via CO2 Extrusion-Recombination: Expansion of a Classic Bond-Forming Strategy via Metallaphotoredox

Storage Class Code

11 - Combustible Solids

WGK

WGK 3

Flash Point(F)

Not applicable

Flash Point(C)

Not applicable

Regulatory Listings

Regulatory Listings are mainly provided for chemical products. Only limited information can be provided here for non-chemical products. No entry means none of the components are listed. It is the user’s obligation to ensure the safe and legal use of the product.

JAN Code

911623-VAR:
911623-1G:
911623-BULK:

Certificates of Analysis (COA)

Search for Certificates of Analysis (COA) by entering the products Lot/Batch Number. Lot and Batch Numbers can be found on a product’s label following the words ‘Lot’ or ‘Batch’.

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Chi Chip Le et al.
Journal of the American Chemical Society, 137(37), 11938-11941 (2015-09-04)
In this study we demonstrate that molecular fragments, which can be readily coupled via a simple, in situ RO-C═OR bond-forming reaction, can subsequently undergo metal insertion-decarboxylation-recombination to generate Csp(2)-Csp(3) bonds when subjected to metallaphotoredox catalysis. In this embodiment the conversion
David J P Kornfilt et al.
Journal of the American Chemical Society, 141(17), 6853-6858 (2019-04-16)
Copper oxidative addition into organohalides is a challenging two-electron process. In contrast, formal oxidative addition of copper to Csp2 carbon-bromine bonds can be accomplished by employing latent silyl radicals under photoredox conditions. This novel paradigm for copper oxidative addition has

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