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Key Documents

Safety Information

667528

Sigma-Aldrich

Copper etchant

Synonym(s):

Copper etching solution

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About This Item

MDL number:
MFCD00161912
UNSPSC Code:
12352300
NACRES:
NA.23

vapor density

1.3 (vs air)

Related Categories

Application

CE-200 solution can be used to etch out the copper residue or foil from the chemical vapor deposited (CVD) graphene or carbonated films by immersing the substrate with the nanomaterial into the etchant solution for 30 min.
It is ideal for spray etching of copper. Ferric chloride based Cu etchant with etch rate of 0.5 mil/min @ 40 °C.

Pictograms

Corrosion
GHS05

Signal Word

Danger

Hazard Statements

H290,H314

Hazard Classifications

Eye Dam. 1 - Met. Corr. 1 - Skin Corr. 1

Storage Class Code

8B - Non-combustible corrosive hazardous materials

WGK

WGK 1

Flash Point(F)

Not applicable

Flash Point(C)

Not applicable

Personal Protective Equipment

dust mask type N95 (US), Eyeshields, Gloves

Regulatory Listings

Regulatory Listings are mainly provided for chemical products. Only limited information can be provided here for non-chemical products. No entry means none of the components are listed. It is the user’s obligation to ensure the safe and legal use of the product.

ISHL Indicated Name

Substances Subject to be Indicated Names

ISHL Notified Names

Substances Subject to be Notified Names

JAN Code

667528-VAR:
667528-BULK:
667528-500ML:4548173923154

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Certificates of Analysis (COA)

Lot/Batch Number
MKCP3897
MKCM9461
MKCK7427
MKCH5366
MKCF6308

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Microbial colonisation of transparent glass-like carbon films triggered by a reversible radiation-induced hydrophobic to hydrophilic transition
Jalvo B, et al.
Royal Society of Chemistry Advances, 6(55), 50278-50287 (2016)
The effect of copper pre-cleaning on graphene synthesis
Kim SM, et al.
Nanotechnology, 24(36), 365602-365602 (2013)
Copper etching with cupric chloride and regeneration of waste etchant
Cakir O
Journal of Materials Processing Technology, 175(1-3), 63-68 (2006)

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