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643262

Sigma-Aldrich

Gold coated silicon wafer

99.999% (Au), layer thickness 1000 Å, 99.99% (Ti)

Synonym(s):

gold coated silicon, gold coated wafer

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About This Item

Linear Formula:
Au
Molecular Weight:
196.97
MDL number:
MFCD00003436
UNSPSC Code:
12352103
PubChem Substance ID:
329759955
NACRES:
NA.23

Quality Level

100

Assay

99.99% (Ti)
99.999% (Au)

diam. × thickness

4 in. × 500 μm

layer thickness

1000 Å

matrix attachment

Titanium, as adhesion layer used to bind the gold to the silicon wafer.

SMILES string

[Au]

InChI

1S/Au

InChI key

PCHJSUWPFVWCPO-UHFFFAOYSA-N

Related Categories

General description

Our gold-coated silicon wafers use electron-beam lithography to form amorphous layers (50Å of titanium followed by 1000Å of gold) on top of the silicon wafer.
The product is highly crystalline, with <111> orientation gold and <100> orientation silicon wafer is used. Titanium is used as an adhesion layer to bind gold to the silicon wafer.

Application

Gold coated silicon wafers may be used in soft lithography for micro and nanoscale patterning.

Packaging

Packaging 1 set in single wafer shipper

Storage Class Code

11 - Combustible Solids

WGK

WGK 3

Flash Point(F)

Not applicable

Flash Point(C)

Not applicable

Regulatory Listings

Regulatory Listings are mainly provided for chemical products. Only limited information can be provided here for non-chemical products. No entry means none of the components are listed. It is the user’s obligation to ensure the safe and legal use of the product.

JAN Code

643262-BULK:
643262-1EA:
643262-1EA-PW:
643262-VAR:

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Certificates of Analysis (COA)

Lot/Batch Number
MKCQ6138
MKCQ4538
MKCQ4537
MKCP7039
MKCP4997

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Aguilar, M. et al.
Surface Science, 482-485, 935-935 (2001)

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