651834

Nichrome etchant

standard

• MDL number: MFCD07370976
• UNSPSC Code: 12161700
• NACRES: NA.23

Properties

• grade: standard
• composition: volatiles, 85%
• color: clear yellow-orange
• bp: 100 °C/1 atm
• density: 1.16 g/mL at 25 °C

Description

General description

Nichrome etchant is a high purity etching system that is a mixture of ceric ammonium nitrate and nitric acid. It can be used to etch the nickel and chromium alloy.

Application

Ceric ammonium nitrate-based etchant. Etches Al, Cr, Cu, Ni, GaAs. Surface oxidizes Si, Ta/TaN. Etch rate of 50 Å/sec @ 40 °C. Etches cleanly with only a deionized water rinse needed.

Nichrome etchant is used in the fabrication of microheater patterns of polydimethyl siloxane (PDMS), silica (SiO₂) and glass substrates, which can be further used in the fabrication of flow sensors. It may also be used to etch out nickel (Ni) from the electroplated Ni on amorphous silica wafers.

For use at room temperature or elevated temperature. Etches cleanly, eliminating need for an intermediate rinse.

Features and Benefits

Designed for etching nichrome thin films used in microelectronic applications. Compatible with both positive and negative photoresists and provides fine-line control with minimal undercutting. Filtered to 0.2 micron to remove particlulates and composed of semiconductor grade materials.

Safety Information

• Pictograms: GHS03,GHS05,GHS07,GHS09
• Signal Word: Danger
• Hazard Statements: H272,H290,H314,H317,H411
• Precautionary Statements: P210 - P220 - P273 - P280 - P303 + P361 + P353 - P305 + P351 + P338
• Hazard Classifications: Aquatic Chronic 2 - Eye Dam. 1 - Met. Corr. 1 - Ox. Liq. 2 - Skin Corr. 1B - Skin Sens. 1
• Supplementary Hazards: EUH071
• Storage Class Code: 5.1B - Oxidizing hazardous materials
• WGK: WGK 3
• Flash Point(F): Not applicable
• Flash Point(C): Not applicable