667447

Ceramic Etchant A

• Synonym(s): Al₂O₃ Etch, Aluminum Oxide Etchant, GaN Etch, Gallium Nitride Etchant, Si₃N₄ Etch, Silicon Nitride Etchant
• MDL number: MFCD08705343
• UNSPSC Code: 12352300
• NACRES: NA.23

Properties

• Quality Level: 100

Description

Application

Useful for fast and controllable etching of silicon nitride (Si₃N₄), galium nitride (GaN), or aluminum oxide (Al₂O₃).

Features and Benefits

Etch Rates @ 180 °C:
Aluminum oxide 120 Å/min
Silicon nitride 125 Å/min
Gallium nitride 80 Å/min
Silicon dioxide 1 Å/min
Silicon 1 Å/min

Safety Information

• Pictograms: GHS05,GHS07
• Signal Word: Danger
• Hazard Statements: H290,H302,H314
• Precautionary Statements: P234 - P270 - P280 - P301 + P312 - P303 + P361 + P353 - P305 + P351 + P338
• Hazard Classifications: Acute Tox. 4 Oral - Eye Dam. 1 - Met. Corr. 1 - Skin Corr. 1B
• Storage Class Code: 8B - Non-combustible corrosive hazardous materials
• WGK: WGK 1
• Flash Point(F): Not applicable
• Flash Point(C): Not applicable
• Personal Protective Equipment: dust mask type N95 (US), Eyeshields, Gloves