643262

Goldbeschichtete Silizium-Wafer

99.999% (Au), layer thickness 1000 Å, 99.99% (Ti)

• Synonym(e): gold coated silicon, gold coated wafer
• Lineare Formel: Au
• Molekulargewicht: 196.97
• MDL-Nummer: MFCD00003436
• UNSPSC-Code: 12352103
• PubChem Substanz-ID: 329759955
• NACRES: NA.23

Eigenschaften

• Assay: 99.99% (Ti); 99.999% (Au)
• Durchm. × Dicke: 4 in. × 500 μm
• Schichtdicke: 1000 Å
• Matrixanbindung: Titanium, as adhesion layer used to bind the gold to the silicon wafer.
• SMILES String: [Au]
• InChI: 1S/Au
• InChIKey: PCHJSUWPFVWCPO-UHFFFAOYSA-N

Beschreibung

Allgemeine Beschreibung

Titanium adhesion layer used to bind the gold to a silicon wafer <100>. Gold orientation is nominally highly polycrystalline with a preference to <111> orientation.

Our gold-coated silicon wafers use electron-beam lithography to form amorphous layers (50Å of titanium followed by 1000Å of gold) on top of the silicon wafer.

Anwendung

Gold coated silicon wafers may be used in soft lithography for micro and nanoscale patterning.

Verpackung

Packaging 1 set in single wafer shipper

Sicherheitshinweise

• Lagerklassenschlüssel: 11 - Combustible Solids
• WGK: WGK 3
• Flammpunkt (°F): Not applicable
• Flammpunkt (°C): Not applicable