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203149

Sigma-Aldrich

Copper(II) chloride

99.999% trace metals basis

Synonyme(s) :

Cupric chloride

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About This Item

Formule linéaire :
CuCl2
Numéro CAS:
7447-39-4
Poids moléculaire :
134.45
Numéro CE :
231-210-2
Numéro MDL:
MFCD00010972
Code UNSPSC :
12352302
eCl@ss :
38150111
ID de substance PubChem :
24852150
Nomenclature NACRES :
NA.23

Pureté

99.999% trace metals basis

Forme

powder

Pertinence de la réaction

reagent type: catalyst
core: copper

Impuretés

≤15.0 ppm Trace Metal Analysis

Pf

620 °C (lit.)

Densité

3.386 g/mL at 25 °C (lit.)

Application(s)

battery manufacturing

Chaîne SMILES 

Cl[Cu]Cl

InChI

1S/2ClH.Cu/h2*1H;/q;;+2/p-2

Clé InChI

ORTQZVOHEJQUHG-UHFFFAOYSA-L

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Description générale

Copper chloride is a white solid. It is insoluble in water. Copper(II) chloride may be prepared by dissolving excess of copper (II) oxide or copper(II) carbonate in dilute hydrochloric acid.

Application

Noble-Metal Nanostructures with Controlled Morphologies
Adding CuCl2 to AgNO3 with EG1mYAbe is used to produce uniform Ag nanowires. Copper chloride may be used as a catalyst in organic chlorination reactions. Used with palladium in a catalytic synthesis of 3-haloindoles via an annulation process.

Pictogrammes

CorrosionExclamation markEnvironment
GHS05,GHS07,GHS09

Mention d'avertissement

Danger

Mentions de danger

H302 + H312,H315,H318,H410

Classification des risques

Acute Tox. 4 Dermal - Acute Tox. 4 Oral - Aquatic Acute 1 - Aquatic Chronic 2 - Eye Dam. 1 - Skin Irrit. 2

Code de la classe de stockage

8A - Combustible corrosive hazardous materials

Classe de danger pour l'eau (WGK)

WGK 3

Point d'éclair (°F)

Not applicable

Point d'éclair (°C)

Not applicable

Équipement de protection individuelle

dust mask type N95 (US), Eyeshields, Gloves

Faites votre choix parmi les versions les plus récentes :

Certificats d'analyse (COA)

Lot/Batch Number
MKBZ8739V
MKBZ0587V
MKBS7226V
MKBR3690V
MKBM6521V

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Retrouvez la documentation relative aux produits que vous avez récemment achetés dans la Bibliothèque de documents.

Consulter la Bibliothèque de documents

Noble-Metal Nanostructures with Controlled Morphologies
Jiang M, et al.
Material Matters, 4(1) null
Handbook of Copper Compounds and Applications null
Chemistry (Weinheim An Der Bergstrasse, Germany) null
Synthesis, 1841-1841 (2007)
Pieter Spincemaille et al.
Toxicology and applied pharmacology, 280(2), 345-351 (2014-08-20)
Wilson disease (WD) is caused by accumulation of excess copper (Cu) due to a mutation in the gene encoding the liver Cu transporter ATP7B, and is characterized by acute liver failure or cirrhosis and neuronal cell death. We investigated the
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Protocoles

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