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643262

Sigma-Aldrich

Gold coated silicon wafer

99.999% (Au), layer thickness 1000 Å, 99.99% (Ti)

Synonym(s):

gold coated silicon, gold coated wafer

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About This Item

Linear Formula:
Au
Molecular Weight:
196.97
MDL number:
UNSPSC Code:
12352103
PubChem Substance ID:
NACRES:
NA.23

Quality Level

Assay

99.99% (Ti)
99.999% (Au)

diam. × thickness

4 in. × 500 μm

layer thickness

1000 Å

matrix attachment

Titanium, as adhesion layer used to bind the gold to the silicon wafer.

SMILES string

[Au]

InChI

1S/Au

InChI key

PCHJSUWPFVWCPO-UHFFFAOYSA-N

General description

Our gold-coated silicon wafers use electron-beam lithography to form amorphous layers (50Å of titanium followed by 1000Å of gold) on top of the silicon wafer.
The product is highly crystalline, with <111> orientation gold and <100> orientation silicon wafer is used. Titanium is used as an adhesion layer to bind gold to the silicon wafer.

Application

Gold coated silicon wafers may be used in soft lithography for micro and nanoscale patterning.

Packaging

Packaging 1 set in single wafer shipper

Storage Class Code

11 - Combustible Solids

WGK

WGK 3

Flash Point(F)

Not applicable

Flash Point(C)

Not applicable


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Aguilar, M. et al.
Surface Science, 482-485, 935-935 (2001)

Articles

1-Adamantanethiol (1-AD), an example in this spectrum of molecules with distinct chemical and physical properties, forms self-assembled monolayers (SAMs) on Au{111} that are displaceable when exposed to other thiolated molecules from solution, vapor, or contact due to weak intermolecular interactions in 1-AD SAMs.

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