663301
69.3 mmHg ( 60 °C)
heat of vaporization: ~41.9 kJ/mol (Dimer)
liquid
core: aluminum
125-126 °C (lit.)
127 °C/760 mmHg
20 °C/8 mmHg
56 °C/50 mmHg
15 °C (lit.)
0.752 g/mL at 25 °C (lit.)
C[Al](C)C
1S/3CH3.Al/h3*1H3;
JLTRXTDYQLMHGR-UHFFFAOYSA-N
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Danger
Pyr. Liq. 1 - Skin Corr. 1B - Water-react. 1
4.2 - Pyrophoric and self-heating hazardous materials
nwg
No data available
No data available
dust mask type N95 (US), Eyeshields, Gloves
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Ask a Scientist here.
In recent years considerable interest in ALD has emerged, mainly due to its ability to controllably coat even very small structures, e.g. nanoor microstructures.
Atomic layer deposition (ALD) techniques have emerged in the last ten years to meet various needs including semiconductor device miniaturization, conformal deposition on porous structures and coating of nanoparticles. ALD is based on two sequential self-limiting surface reactions.
igma-Aldrich.com presents an article regarding the savannah ALD system - an excellent tool for atomic layer deposition.
Nanocomposite Coatings with Tunable Properties Prepared by Atomic Layer Deposition
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