Product Number
Brand
Product Description
Sigma-Aldrich
Copper, turnings, purum p.a., ≥99.0%
Sigma-Aldrich
Copper, electrolytic, Analytical Reagent, reag. Ph. Eur., ≥99.9% (complexometric), wire
Sigma-Aldrich
Copper, foil, ≥99.8% (complexometric)
Sigma-Aldrich
Copper, rod, diam. 11 mm, 99.9999% trace metals basis
Sigma-Aldrich
Copper, foil, thickness 1.0 mm, 99.999% trace metals basis
Sigma-Aldrich
Copper, beads, 2-8 mm, 99.9995% trace metals basis
Sigma-Aldrich
Copper, beads, 2-8 mm, ≥99.99% trace metals basis
Sigma-Aldrich
Copper, powder, <75 μm, 99%
Sigma-Aldrich
Copper, wire, diam. 1.0 mm, ≥99.9%
Sigma-Aldrich
Copper, foil, thickness 0.5 mm, 99.98% trace metals basis
Sigma-Aldrich
Copper, wire, diam. 0.25 mm, 99.999% trace metals basis
Sigma-Aldrich
Copper, wire, diam. 2.0 mm, 99.999% trace metals basis
Sigma-Aldrich
Copper, wire, diam. 0.64 mm, 99.995% trace metals basis
Sigma-Aldrich
Copper, foil, thickness 0.025 mm, 99.98% trace metals basis
Supelco
Copper (impurities), manufactured by MBH Analytical Ltd (39X 17868)
Sigma-Aldrich
Copper, bars (random sizes), ≥99.999% trace metals basis
Sigma-Aldrich
Copper, powder, 99.999% trace metals basis
Sigma-Aldrich
Copper, foil, thickness 0.25 mm, 99.98% trace metals basis
Sigma-Aldrich
Copper, spherical shot, −20-+30 mesh, ≥99.5% trace metals basis
Sigma-Aldrich
Copper, powder, <425 μm, 99.5% trace metals basis
Sigma-Aldrich
Copper, powder (dendritic), <45 μm, 99.7% trace metals basis
Sigma-Aldrich
Copper, sputtering target, diam. × thickness 2.00 in. × 0.25 in., 99.95% trace metals basis
Sigma-Aldrich
Copper, nanopowder, 60-80 nm particle size (SAXS), ≥99.5% trace metals basis
Sigma-Aldrich
Copper, powder (spheroidal), 10-25 μm, 98%
Copper (O), BCR®, certified reference material, rod
Copper (S, P), BCR®, certified reference material, chips
Sigma-Aldrich
Copper, shot, −3-+14 mesh, 99%
Sigma-Aldrich
Copper, ACS reagent, granular, 10-40 mesh, ≥99.90%
Copper, IRMM®, certified reference material, 0.5 mm wire