Direkt zum Inhalt
Merck

Removal of Cu(II) from acidic electroplating effluent by biochars generated from crop straws.

Journal of environmental sciences (China) (2013-08-09)
Xuejiao Tong, Renkou Xu
ZUSAMMENFASSUNG

The removal efficiency of copper (Cu(II)) from an actual acidic electroplating effluent by biochars generated from canola, rice, soybean and peanut straws was investigated. The biochars simultaneously removed Cu(II) from the effluent, mainly through the mechanisms of adsorption and precipitation, and neutralized its acidity. The removal efficiency of Cu(II) by the biochars followed the order: peanut straw char > soybean straw char > canola straw char > rice straw char > a commercial activated carbonaceous material, which is consistent with the alkalinity of the biochars. The pH of the effluent was a key factor determining the removal efficiency of Cu(II) by biochars. Raising the initial pH of the effluent enhanced the removal of Cu(II) from it. The optimum pyrolysis temperature was 400 degrees C for producing biochar from crop straws for acidic wastewater treatment, and the optimum reaction time was 8 hr.

MATERIALIEN
Produktnummer
Marke
Produktbeschreibung

Sigma-Aldrich
Kupfer, powder, 99.999% trace metals basis
Sigma-Aldrich
Kupfer, foil, thickness 0.25 mm, 99.98% trace metals basis
Sigma-Aldrich
Kupfer, powder, <425 μm, 99.5% trace metals basis
Sigma-Aldrich
Kupfer, wire, diam. 1.0 mm, ≥99.9%
Sigma-Aldrich
Kupfer, powder (spheroidal), 10-25 μm, 98%
Sigma-Aldrich
Kupfer, nanopowder, 40-60 nm particle size (SAXS), ≥99.5% trace metals basis
Sigma-Aldrich
Kupfer, powder, <75 μm, 99%
Sigma-Aldrich
Kupfer, wire, diam. 0.25 mm, 99.999% trace metals basis
Sigma-Aldrich
Kupfer, foil, thickness 0.025 mm, 99.98% trace metals basis
Sigma-Aldrich
Kupfer, nanopowder, 60-80 nm particle size (SAXS), ≥99.5% trace metals basis
Sigma-Aldrich
Kupfer, powder (dendritic), <45 μm, 99.7% trace metals basis
Sigma-Aldrich
Kupfer, foil, ≥99.8% (complexometric)
Sigma-Aldrich
Kupfer, turnings, purum p.a., ≥99.0%
Sigma-Aldrich
Kupfer, foil, thickness 0.5 mm, 99.98% trace metals basis
Sigma-Aldrich
Kupfer, wire, diam. 0.64 mm, 99.995% trace metals basis
Sigma-Aldrich
Kupfer, beads, 2-8 mm, 99.9995% trace metals basis
Sigma-Aldrich
Kupfer, foil, thickness 1.0 mm, 99.999% trace metals basis
Sigma-Aldrich
Kupfer, shot, −3-+14 mesh, 99%
Sigma-Aldrich
Kupfer, wire, diam. 2.0 mm, 99.999% trace metals basis
Sigma-Aldrich
Kupfer, ACS reagent, granular, 10-40 mesh, ≥99.90%
Sigma-Aldrich
Kupfer, beads, 2-8 mm, ≥99.99% trace metals basis
Kupfer (S, P), BCR®, certified reference material, chips
Kupfer, IRMM®, certified reference material, 0.5 mm wire
Kupfer, IRMM®, certified reference material, 0.1 mm foil
Stranggusskupfer (O), BCR®, certified reference material, rod
Kupfer (O), BCR®, certified reference material, rod