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Synthesis of copper nanoparticles with controlled sizes by reverse micelle method.

Synthesis of copper nanoparticles with controlled sizes by reverse micelle method.

Journal of nanoscience and nanotechnology (2013-07-19)

Taekyung Yu, Taeyoung Koh, Byungkwon Lim

ABSTRACT

Copper (Cu) nanoparticles with controllable sizes were successfully synthesized by using a modified reverse micelle method, in which copper(II) acetate was reacted with L-ascorbic acid in a solution containing water and xylene in the presence of oleic acid and oleylamine as surfactants. The as-synthesized Cu nanoparticles had a nearly spherical profile and multiple-twinned structures, whose surface was enclosed by {111} facets. Our synthetic procedure provides a simple and readily scalable route to the preparation of Cu nanoparticles with controllable sizes.

MATERIALS

Product Number

Brand

Product Description

Copper (S, P), BCR^®, certified reference material, chips

Copper, IRMM^®, certified reference material, 0.1 mm foil

Copper, IRMM^®, certified reference material, 0.5 mm wire

Sigma-Aldrich

Copper, powder, 99.999% trace metals basis

Sigma-Aldrich

Copper, shot, −3-+14 mesh, 99%

Copper (O), BCR^®, certified reference material, rod

Sigma-Aldrich

Copper, foil, thickness 0.25 mm, 99.98% trace metals basis

Sigma-Aldrich

Copper, powder, <425 μm, 99.5% trace metals basis

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Copper, powder (dendritic), <45 μm, 99.7% trace metals basis

Sigma-Aldrich

Copper, powder (spheroidal), 10-25 μm, 98%

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Copper, nanopowder, 60-80 nm particle size (SAXS), ≥99.5% trace metals basis

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Copper, ACS reagent, granular, 10-40 mesh, ≥99.90%

Sigma-Aldrich

Copper, nanopowder, 40-60 nm particle size (SAXS), ≥99.5% trace metals basis

Sigma-Aldrich

Copper, foil, ≥99.8% (complexometric)

Sigma-Aldrich

Copper, turnings, purum p.a., ≥99.0%

Sigma-Aldrich

Copper, foil, thickness 1.0 mm, 99.999% trace metals basis

Continuous cast copper (O), BCR^®, certified reference material, rod

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Copper, beads, 2-8 mm, ≥99.99% trace metals basis

Sigma-Aldrich

Copper, powder, <75 μm, 99%

Sigma-Aldrich

Copper, beads, 2-8 mm, 99.9995% trace metals basis

Sigma-Aldrich

Copper, foil, thickness 0.5 mm, 99.98% trace metals basis

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Copper, foil, thickness 0.025 mm, 99.98% trace metals basis

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Copper, wire, diam. 2.0 mm, 99.999% trace metals basis

Sigma-Aldrich

Copper, wire, diam. 0.25 mm, 99.999% trace metals basis

Sigma-Aldrich

Copper, wire, diam. 0.64 mm, 99.995% trace metals basis

Sigma-Aldrich

Copper, wire, diam. 1.0 mm, ≥99.9%